Сервис мануал и схема телефона Panasonic X300​

• 1. INTRODUCTION
• 1.1. Purpose of the Manual
• 1.2. Structure of the Manual
• 1.3. Servicing Responsibilities
• 2. GENERAL DESCRIPTION
• 2.1. General
• 2.2. Features
• 2.3. Handportable Main Kits
• 3. OPERATING INSTRUCTIONS
• 3.1. General
• 3.2. Liquid Crystal Display
• 3.3. Location of Controls
• 3.4. Concept of Operation
• 3.5. Alpha Entry
• 3.5.1. Character Set / Key Assignments
• 3.5.2. Editing Alpha Entry
• 3.6. Menu Structure
• 3.7. Incoming Call Line Identification (CLI)
• 3.8. Public Man Machine Interface (MMI)
• 3.8.1. General
• 3.8.2. Reading the Phonebook Memory Location
• 3.8.3. Presentation of IMEI
• 3.8.4. Security
• 3.8.5. Call Hold
• 3.8.6. Call Waiting
• 3.8.7. Call Line Identification
• 3.8.8. Telecommunication Services used for Public MMI
• 3.8.9. Call Divert
• 3.8.10. Call Bar
• 3.9. Troubleshooting
• 3.10. Important Error Messages
• 3.11. Security Codes
• 3.12. Glossary of Terms
• 4. TECHNICAL SPECIFICATIONS
• 4.1. Tx Characteristics
• 4.1.1. Frequency Error
• 4.1.2. Modulation Phase Error
• 4.1.3. Output RF Spectrum due to Modulation
• 4.1.4. Output RF Spectrum due to Switching Transients
• 4.1.5. Spurious Emissions at Antenna Connector
• 4.1.6. Residual Peak Power
• 4.2. Rx Characteristics
• 4.2.1. Sensitivity
• 5. TECHNICAL DESCRIPTION
• 5.1. RF Overview
• 5.1.1. RF Block Diagram
• 5.1.2. RF Function Block
• 5.1.3. Functional Description
• 5.2. Baseband Overview
• 5.2.1. Introduction
• 5.2.2. Digital Baseband Processor
• 5.2.3. Keypad
• 5.3.4. Subscriber Identity Module (SIM)
• 5.3.5. CPU Memory
• 5.3.6. LCD
• 5.3.7. Real Tim Clock (RTC)
• 5.3. Audio System
• 5.3.1. Voiceband Baseband Codec
• 5.3.2. Microphone
• 5.3.3. Receiver
• 5.3.4. Loud Speaker
• 5.4. Power Management Subsystem
• 5.4.1. Power Source
• 5.4.2. Regulator Control
• 5.4.3. Voltage Regulation
• 5.5. Battery Charging and Monitoring
• 5.5.1. Charging Current
• 5.5.2. Deeply Discharged Batteries
• 5.6. Test Point
• 5.6.1. Test Point Layout
• 6. DISASSEMBLY / REASSEMBLY INSTRUCTIONS
• 6.1. General
• 6.1.1. Call Bar
• 6.2. Disassembly
• 6.3. Reassembly
• 7. REPAIR PROCEDURES
• 7.1. Introduction
• 7.2. Lead Free (PbF) solder
• 7.3. External Testing
• 7.3.1. General Information
• 7.4. Test Equipment Setup
• 7.4.1. Equipment Required
• 8. SOFTWARE DOWNLOAD & ADJUSTMENT PROCEDURE
• 8.1. Service Software Upgrade
• 8.2. MMI Test
• 8.3. Adjustment Procedure
• 8.3.1. Equipment Setting for TX/RX adjustment
• 8.3.2. Main Subjects
• 8.3.3. Test Operation Procedure
• 8.3.4. Enter Test
• 8.3.5. TX Test
• 8.3.6. RX Test
• 8.3.7. Battery
• 9. REPLACEMENT PARTS LIST
• 9.1. Exploded View
• 9.2. Case and Cover Parts List
• 9.3. Main PCB
• 10. BLOCK DIAGRAM
• 10.1. Baseband
• 10.2. RF Band
• 11. CIRCUIT DIAGRAM
• 11.1. Baseband
• 11.2. RF Band
• 11.3. Analogue Baseband and Power Management
• 11.4. LCD and Camera
• 12. LAYOUT DIAGRAM
• 12.1. Main PCB